As AI-driven computing continues to escalate demands for higher power density and thermal efficiency, Asetek, the pioneer of global liquid cooling technology, today announced the debut of its next-generation liquid cooling platform architecture at Computex 2026. Developed specifically to address the high-performance thermal demands of the AI era, the new architecture sets a new milestone in cooling efficiency and low-acoustic performance. Featuring an optimized 4 mm comprehensive offset cold plate design, Asetek is effectively redefining the thermal standard for high-performance AI computing.

The company also highlighted a broader strategic direction following its strategic integration with Chunqiu Electronic (CQ), combining Asetek's long-established liquid cooling engineering expertise in Denmark with CQ's expanded global manufacturing scale and supply chain infrastructure in Asia. At this year's showcase, Asetek is focusing on the generational evolution of its premium consumer liquid cooling platforms, positioning these advanced thermal architecture developments as the primary technology foundation to anchor future high-density computing and AI thermal infrastructure opportunities.

Next-Generation "Emma Platform" Evolution
Making its Computex debut, the Emma V3 [Gen10] platform represents Asetek's next evolution in AIO cooling architecture, redefining industry thermal standards. Compared to the previous generation under typical TDP workloads, the platform achieves a 1.5°C reduction in thermal resistance and reduces perceived acoustic volume by approximately 45%. It features an advanced dual-offset design utilizing optimized retention kits and center groove micro-channels, engineered specifically for modern CPU hotspot behavior. This architecture delivers superior system integration flexibility, ensuring high-performance AI workloads maintain optimal efficiency. The Emma V3 platform will be showcased through upcoming TRYX ecosystem implementations.

The premium flagship architecture will make its exclusive world debut as the core of an ASUS ROG Limited Special Edition liquid cooler.

"In the era of high-performance AI computing, liquid cooling is no longer just a secondary component; it has become foundational infrastructure that directly impacts the computing efficiency of core processor chips," said André Sloth Eriksen, CEO and Founder of Asetek. "The next-generation Emma platform unveiled at Computex 2026 sets new records in both cooling efficiency and low-acoustic profiles. Asetek's breakthrough technology will further sustain the intense thermal requirements of AI Workstation while simultaneously opening a new chapter in data center server cooling."

Asetek Partners with ADATA, NZXT, and TRYX to Unveil Latest Gaming AIO Models Powered by Ingrid G9
Building on the market success of Asetek's well-established Ingrid platform—which debuted last year with the Antec Vortex View 360 featuring Ingrid [G9] technology—this year's Computex sees ADATA, NZXT, and TRYX adoption, with each brand showcasing their latest flagship AIO models. The Ingrid platform delivers an impressive up to 3 °C reduction in CPU temperatures under typical TDP compared to their respective predecessors, elegantly addressing two distinct market segments:

• Ingrid Mainstream: Combines ultra-low acoustic performance measured at just 18-20 dB(A) from a 25 cm distance with a simplified pre-installed fan structure, powering flagship models from brands including NZXT and TRYX.
• Ingrid Value: Developed in collaboration with ADATA, the ADATA Levante View platform extends the same core thermal architecture and cooling foundation into a more accessible, cost-effective platform tier, broadening adoption across a wider enthusiast audience.

Furthermore, the ASRock Taichi 360 HOLO (powered by Emma V2) will debut to showcase its hardcore thermal engineering. Concurrently, the TRYX HOLO (featuring Sigrid V2) will be on display, seamlessly blending bold visual aesthetics with a distinct interactive experience for premium enthusiasts.

Meeting High-Density Compute Demands: Debut of Professional Workstation Solutions Engineered for Intel Xeon
Asetek has been dedicated to the research, development, and engineering of workstation liquid cooling architectures and technologies since 2021. In response to the soaring market focus on high-density computing, Asetek's workstation thermal solutions for Intel Xeon and AMD Ryzen Threadripper processors have earned deep trust and validation from elite industry partners including ASUS, Antec, and Phanteks.

This year, Asetek will showcase an Intel Xeon workstation liquid cooling integration at the ASUS and Phanteks booths. Concurrently, the Phanteks and Antec booths will display premium AIO coolers supporting AMD Ryzen Threadripper workstation processors. Featuring a 100% full Integrated Heat Spreader (IHS) coverage design, Asetek's workstation AIO solutions effortlessly unlock extreme 450 W+ TDP limits that far exceed traditional consumer hardware constraints, meeting the heightened industry demand for robust compute infrastructure with proven technical reliability.

Asetek's R&D leadership team will be present during Computex to share additional engineering insights and platform discussions with attending media. Asetek technologies and partner products will be showcased across ADATA, Antec, ASRock, ASUS ROG, NZXT, Phanteks and TRYX partner booths during Computex 2026.