Cooling Channel Design Optimization for High Power Multi-Chip Packages
[Submitted on 20 May 2026 (v1), last revised 3 Jun 2026 (this ve
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2026-06-04
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via stat updates on arXiv.org
arXiv:2605.20657v2 Announce Type: replace-cross Abstract: Thermal management is a major challenge in next-gen…
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