The National Advanced Packaging Manufacturing Program (NAPMP) and NASA Ames Research Center in California’s Silicon Valley are co-hosting an Advanced Packaging Summit as a hybrid virtual and in-person event at the NASA Ames Conference Center in Moffett Field, California. The Summit will run from 8:30 a.m. - 5:30 p.m. PDT from April 18 - 19, 2024. This event will bring together technical experts from industry, academia, government, and industry alliances to identify key technical challenges and strategic approaches in advanced semiconductor packaging.
The Summit will be a place to foster collaboration, coordination, and innovation within the advanced packaging community. Participants will discuss:
This two-day hybrid event provides an opportunity to network and exchange ideas with thought leaders across the sector. Both days feature plenary and panel sessions with exemplary keynote and guest speakers mixed with interactive breakout sessions. Collectively, these sessions provide an opportunity for participants to collaborate and discuss key questions and topics that will shape future advanced packaging efforts. Topics to be considered include:
We encourage interested stakeholders, industry representatives, technical experts and researchers, and industry alliances to participate actively in this pivotal event. We welcome both domestic and international participation, as fostering global collaboration and enriching the discussions on advancing semiconductor standards and innovation are paramount to success.
Note to Foreign National registrants (both in-person and virtual): In preparation for your attendance to the CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Summit, you will receive a NASA Identity Invitation email and a Pass Phrase email. Please be responsive to upload your identification information to the secure system. Registration for the summit near the deadline might not allow sufficient time to process your attendance request.
Advanced Packaging Summit Agenda
April 18–19, 2024
Held at NASA Ames Conference Center
DAY 1 | ||
8:00 – 9:00 am | Check-In | |
9:00 – 9:20 am | Introduction and Welcome Review Agenda, Expectations & logistics | Subu Iyer, Director NAPMP Bapi Vinnakota, NAPMP |
9:20 – 9:25 am | Opening Remarks DoC | Under Secretary Laurie Locascio |
9:25 – 9:30 am | Opening Remarks NASA | Eugene Tu, NASA |
9:30 – 9:50 am | DARPA & National Strategy on Microelectronics Research | Carl McCants, DARPA |
9:50 – 10:10 am | Natcast | Deirdre Hanford, Natcast |
10:10 – 10:30 am | Break | Break |
10:30 – 11:00 am | Semiconductor startup and investment landscape in 2024 … the worst and best of times | Daniel Armbrust, Silicon Catalyst |
11:00 –11:30 am | NAPMP Overview | Daniel Berger, NAPMP |
11:30 - 11:50 am | Chiplets | Bapi Vinnakota, NAPMP |
11:50 – 1:00 pm | Lunch | Lunch |
1:00 – 3:00 pm | Panel: Applications – HPC & AI | Moderator: John Shalf, DOE |
3:00 – 3:15 pm | Break | Break |
3:15 – 4:30 pm | Panel: Applications – Aerospace & Automotive | Moderator: Scott Bukofsky, NSTC |
4:30 – 5:30 pm | Panel: Applications - Low Power | Moderator: George Orji, NAPMP |
5:30 pm | Wrap up, Adjourn | George Orji, NAPMP |
DAY 2 | ||
8:30 – 9:00 am | Check-In (if needed) | |
9:00 – 9:05 am | Review Agenda & Logistics | NAPMP |
9:05 – 9:35 am | Semiconductors for the Future of Aerospace | Prasun Desai, NASA |
9:35 – 10:05 am | Enabling Moore’s Law’s Through Heterogeneous Integration | Raja Swaminathan, AMD |
10:05 – 10:20 am | Break | Break |
10:20 – 11:30 am | Panel: Support for Startups | Moderator: Daniel Armbrust, Silicon Catalyst |
11:30 – 12:30 pm | Lunch Break | Break |
12:30 – 1:45 pm | Panel: Applications – Biomedical | Moderator: Andy DeHennis, CHIPS R&D |
1:45 – 3:00 pm | Panel: Packaging Pilot Needs & The Path to HVM | Moderator: Erik Hadland, SIA |
3:00– 3:15 pm | Break | Break |
3:15 – 4:15 pm | Panel: Emerging Challenges to Advanced Packaging | Moderator: Eric Lin, CHIPS R&D |
4:15 – 5:30 pm | Advanced Packaging Acceleration | K.C. Hsu, TSMC |
Panel: Accelerating the Adoption of Advanced Packaging | Moderator: Bapi Vinnakota, NAPMP | |
5:30 pm | Closing Remarks, Adjourn | George Orji, NAPMP |
For PDF, CLICK HERE
Program Committee:
David LaVan (CHIPS)
Bryan Biegel (NASA)
Bapi Vinnakota (CHIPS)
Greg Yeric (CHIPS)
Matt Kelly (IPC)
Matt Walsh (DoD – ReShape)
Erik Hadland (SIA)
Andrew DeHennis (CHIPS)
Note to Foreign National registrants (both in-person and virtual): In preparation for your attendance to the CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Summit, you will receive a NASA Identity Invitation email and a Pass Phrase email. Please be responsive to upload your identification information to the secure system. Registration for the summit near the deadline might not allow sufficient time to process your attendance request.
Per NASA policy regarding on-site meetings and conferences: Meetings and conferences that are held at a NASA Center are considered on-site meetings or conferences, regardless of the content of that meeting or conference. All on-site meetings and conferences are required to undergo full identity vetting. A full list of foreign national attendees must be provided to the IVC, through IdMAX, to ensure appropriate vetting occurs prior to the visit and to facilitate entry of the visitor to the meeting or conference. These foreign national attendees must be assigned an ACP and are required to follow all requirements of their ACP.
All visitors/guests will need to pass a photo identification (ID)* checkpoint.*US Citizens please see information regarding the REAL ID Act of 2005 below. International participants are required to present a passport. Permanent residents are required to present their Green Card.
*Visitor Access Requirement:
For Non-US Citizens: Please have your valid passport for photo identification.
For US Permanent Residents: Please have your green card for photo identification.
For US Citizens: For US Citizens: Please have your state-issued driver's license. Regarding Real-ID requirements, all states are in compliance or have an extension through May 2025
NASA also accepts other forms of federally issued identification in lieu of a state-issued driver's license, such as a valid passport, passport card, DOD's Common Access Card (CAC), Veterans ID, Federal Agency HSPD-12 IDs, and Military Dependents ID.
Created March 21, 2024, Updated April 16, 2024
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